| Layer Count |
1 ¨C 12 Layers |
| Laminates |
FR-4 (Tg 130¡æ & Tg 170¡æ)
FR-4 (Halogen Free), CEM-3, CEM-1 |
| Maximum Set Size |
11¡± x 17 ¡± (279.4 x 431.8mm) |
| Maximum Board Thickness |
3.20mm |
| Minimum Board Thickness |
2-Layer
4-Layer
6-Layer
8-Layer
10-Layer
12-Layer |
0.20mm
0.60mm
0.80mm
1.00mm
1.20mm
1.40mm |
| Copper Thickness (Inner) |
H oz, 1 oz, 2 oz, 3 oz |
| Copper Thickness (Outer) |
H oz, 1 oz, 2 oz, 3 oz, 4 oz |
| Minimum Hole Size |
0.25 mm(PTH) |
| Aspect Ratio |
1 : 6.4 |
| Hole Size Tolerance |
¡À 0.076mm (PTH)
¡À 0.05mm (NPTH) |
| Minimum Line Width / Space |
H oz
H oz
H oz
1 oz
2 oz
3 oz |
4 mil / 4 mil (General)
4 mil / 4 mil (COB Gold Plating)
5 mil / 5 mil (COB ENIG)
5 mil / 5 mil
7 mil / 7 mil
9 mil / 9 mil |
| Minimum Space between PTH and line |
2-Layer
4-Layer
6-Layer
8-Layer
10-Layer
12-Layer |
6 mil
8 mil
10 mil
10 mil
12 mil
12 mil |
| E-test |
10 ¨C 300V, Max. 50 M¦¸ |
| Hi-Voltage Test |
AC/DC, 0 ¨C 5kV, max. 100MA |
| Profiling |
CNC Routing
Punching
V-Cut |
| Routing Outline Tolerance |
¡À 4 mil |
| Special Process
(To be Confirmed Case by Case) |
Blind / Buried Via Hole
Selective Gold Plating |
| Impedance Control
(To be Confirmed Case by Case) |
¡À 10%
(Min. Line Width/Space 5mil / 5mil, >
50 ohm) |
